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Neuromorphic Computing and Brain-Inspired Systems

Principal Investigators: Abderazek Ben Abdallah (PI), Khanh N. Dang (PI)

NASH Architecture ApproxiMorph BTSAM Thermal 3D Synaptic Memory R-MaS3N (Robust) Patents AIzuHand

NASH: Neuromorphic Adaptive System Hardware

NASH System

We are pioneering the development of the NASH chip, an ultra-low-power processing unit designed for real-time cognitive tasks. This research focuses on the integration of 3D Network-on-Chip (NoC) interconnects to overcome the data-movement bottlenecks of conventional 2D architectures. By utilizing adaptive configuration methods, the NASH system allows for on-the-fly adjustment of Spiking Neural Network (SNN) parameters, including synaptic weights and neuronal thresholds. This flexibility enables the hardware to self-optimize for diverse biological signals, bringing high-performance brain-inspired processing to edge-level BCI devices.

ApproxiMorph: Energy-Efficient AI Co-Design

ApproxiMorph exploits the inherent noise resilience of Spiking Neural Networks by implementing layer-wise approximation strategies within 3D-stacked IC designs. The framework integrates approximate neuron designs with low-voltage 3D-stacked SRAM to significantly reduce the power-per-synaptic operation. By utilizing a heuristic search algorithm to navigate a massive configuration space (over 1017 options), the system identifies optimal mappings that achieve nearly 30% power reduction with almost no impact on classification performance.

ApproxiMorph Framework

BTSAM: Balanced Thermal-State-Aware Mapping

The BTSAM framework introduces a periodic activity scoring system to monitor the workload of 3D-NoC nodes. By applying Seesaw Neuron Clustering (SNC) and a thermal-aware genetic algorithm, the system dynamically redistributes neuronal tasks to eliminate hot spots. This proactive thermal management prevents structural damage and results in a 5K peak temperature reduction and a four-fold increase in Mean-Time-to-Failure (MTTF).

BTSAM Thermal Management

Partial Voltage Scaling in 3D Stacking Synaptic Memory

This research tackles the "memory wall" by decoupling synaptic weight storage from processing elements through vertical stacking. By splitting synaptic weights into significant and least-significant subsets across different 3D layers, the system can independently control the supply voltage. This allows for power-gating of memory layers containing less critical data, achieving SOP energy reductions of up to 66%.

3D Memory Stacking

R-MaS3N: Robust Fault-Tolerant Mapping

R-MaS3N is a mapping framework designed to maintain system integrity in the presence of physical manufacturing defects. When a hardware fault is detected, R-MaS3N facilitates rapid remapping of SNN layers to functional neuronal clusters. The system maintains 100% efficiency even when 40% of hardware nodes are faulty, reducing remapping time by 71 times compared to conventional methods.

Fault Tolerant Remapping

Registered and Provisional Patents

  • [Patent No. 7699791] (June 20, 2025) ? Abderazek Ben Abdallah, Hoang Huang Kun, Dang Nam Khanh, Song Janning, "AI Processor" [Source]
  • [Patent No. 7277682] (May 11, 2023) ? Abderazek Ben Abdallah, The H. Vu, Masayuki Hisada, "Spiking Neural Network by 3D NoC" [Google Patents]
  • Neural Network Processor (Provisional 2024-047372) ? Khanh N. Dang, Abderazek Ben Abdallah, Nguyen Ngo Doanh